Korea Authorized Distributor
sales@wholesale-k.com | wholesale@wholesale-k.com | KR ·EN· 中文

Electronics solutions

Halocarbon sits at the leading edge of the modern microelectronics industry. From lithium-ion battery electrolyte additives to next-generation semiconductor photoresist monomers, polyimide solutions for flexible displays, and electronics-grade solvents — we supply specialty fluorochemical products at the scale and quality the global electronics industry demands. Wholesale Industry delivers them to the Korean market.

01 · Battery

Lithium ion battery solutions

Lithium-ion batteries are the core energy source for EVs, ESS and mobile devices, and as energy density rises the challenges of electrolyte stability and safety intensify. Halocarbon's fluorinated electrolyte additives and co-solvents are designed to protect the electrolyte under high-voltage, high-temperature conditions and to lift cell life and safety together.

Battery
4 Key Benefits

How fluorinated additives change cell behavior

  • Improved electrolyte stability · reduced high-voltage (>4.3V) decomposition
  • Cell-component compatibility · improved charge transport
  • Optimized SEI layer formation · reduced initial-cycle loss
  • Reduced gas generation · suppressed cell swelling
Target Cell Designs

Applicable cell configurations

  • High Nickel NMC (NMC 811 and above) cathodes
  • Silicon-containing / Li metal anodes
  • High-voltage (>4.3V) cell structures
  • Next-generation all-solid-state & polymer hybrid cells
Electrolyte Additive · Ether
LiB 2100 ET
High Nickel NMC · nonflammable
Type
Ether-based
Cathode
High Ni NMC
Temp
High-temp swell reduction

Nonflammable ether-based additive. Reduces high-temp swelling & improves cycle life.

Electrolyte Additive · Ester
LiB 2100 ES
High Nickel NMC compatible
Type
Ester-based
Cathode
High Ni NMC
Role
Co-solvent

Ester-based co-solvent & additive for high-capacity cells.

Electrolyte Additive · Ether
LiB 1200 ET
Li metal anode · high boiling point
Type
Ether-based
Anode
Li metal
BP
High

High-boiling-point ether for Li metal anodes. High anodic stability.

Electrolyte Additive
LiB 2100 CR
High Nickel NMC
Role
Additive
Cathode
High Ni NMC
Feature
Cycle life

LiB 2100 series variant for improved cycle life.

Electrolyte Additive · Ether
LiB 2201 ET
High-energy-density cells
Type
Ether-based
Target
High-density
Feature
Thermal

Strengthens long-term stability under high-energy-density, high-temperature conditions.

Electrolyte Additive · Ester
LiB 1101 ES
Silicon anode compatible
Type
Ester-based
Anode
Si-containing
Role
SEI formation

Assists SEI layer formation on silicon-containing anodes.

Electrolyte Additive · Carbonate
F3EMC
High voltage · >4.3V
Type
Carbonate
Voltage
>4.3V
Ref
Nat. Energy

Carbonate-based additive for high-voltage cells. Reduces high-voltage decomposition.

Mechanism
Conventional hydrocarbon-based
Halocarbon fluorinated additive
High-voltage stability
Accelerated decomposition above 4.2V
C–F bond thermodynamically more stable than C–H
SEI layer
EC/VC-centric, can be non-uniform
Uniform SEI formation, high-voltage protection
Cell swelling
Decomposition-gas buildup
Less decomposition → reduced gas
Ignition risk
Flammable
Many nonflammable variants
We tailor additive and co-solvent proposals to the specific process requirements of battery cell and pack makers across Asia.
02 · Semiconductor

Semiconductor fabrication solutions

For over a decade, Halocarbon has worked with the semiconductor raw-materials supply chain, supplying next-generation photoresist monomers, precursors and specialty fluorochemicals. From 193nm immersion (193i) to extreme-ultraviolet (EUV) lithography, it has systematized the monomer chemistry needed for scaling around HFIP (hexafluoroisopropyl) chemistry.

Semiconductor
Why Fluorochemistry

Three contributions of fluorine in photolithography

  • Transparency control — intrinsically transparent at 193nm. Up to 4× the absorption efficiency of carbon-based materials at EUV
  • Hydrophobicity control — HFIP-based monomers give a high water contact angle, improving 193i scanning speed
  • Solvent compatibility — pH-triggered solubility switching in TMAH alkaline developers
EUV Specific

The role of fluorine in EUV processes

  • Complements and reinforces high-Z metal resists (Tin · Hafnium · Zirconium)
  • Plasma-etch resistance — used as TARC (top anti-reflective coatings)
  • Low surface energy — controls resist adhesion & lift-off
  • Chemical resistance — minimizes outgassing, selective solubility parameters

193 Immersion Lithography Monomers (8)

HFIP Monomer · 193i
Halocarbon TTBD
193i photoresist monomer

HFIP-derivative monomer for 193i photoresists.

HFIP Monomer · MA · 193i
MA-TTBD
Methacrylate form

Methacrylate derivative of TTBD.

HFIP Monomer · 193i/EUV
Halocarbon 3TPD
Shared across 193i & EUV

HFIP monomer usable in both 193i and EUV processes.

HFIP Monomer · MA
MA-3TPD
Methacrylate form

Methacrylate derivative of 3TPD.

HFIP Monomer · 193i
Halocarbon TTPD
193i photoresist

Monomer for 193i immersion lithography.

HFIP Monomer · MA
MA-TTPD
Methacrylate form

Methacrylate derivative of TTPD.

Precursor
HFIP
Hexafluoroisopropyl alcohol

Core precursor for the HFIP family of monomers.

Monomer · MA
MA-HFIP
Methacrylate form

Methacrylate derivative of HFIP. For polymer synthesis.

EUV Lithography Monomers (4)

HFIP Monomer · EUV
Halocarbon 3TPD
5nm and below nodes

HFIP monomer compatible with EUV processes.

HFIP Monomer · MA · EUV
MA-3TPD
Methacrylate · EUV

3TPD methacrylate derivative for EUV.

HFIP Monomer · EUV
Acetonaphtone-HFIP
Enhanced EUV absorption

HFIP variant with improved absorption efficiency at EUV wavelengths.

HFIP Monomer · EUV
Norbornene-HFIP
EUV · rigid backbone

Norbornene-based HFIP monomer. Rigid structure and EUV compatibility.

Specifications, purity and NDA terms for semiconductor photoresists vary greatly by customer. After confirming process conditions, allowable impurities and required quantities in an initial consultation, we coordinate with HQ R&D.
03 · Polyimide

Advanced polyimide solutions

Halocarbon is the only US manufacturer providing the core monomer system for colorless polyimide (colorless polyimide) film. It is a product line that supports the thin, flexible, high-speed evolution of next-generation electronics — flexible displays, low-dielectric-loss applications, photosensitive polyimide (PSPI) and conformal coatings.

Polyimide
Target Applications

Key application areas

  • Flexible OLED & micro-LED display substrates
  • Low-dielectric-loss circuit boards · high-frequency applications
  • Conformal coatings based on photosensitive polyimide (PSPI)
  • Semiconductor packaging · interconnect thin films
Why Fluorinated PI

Benefits of introducing fluorine

  • Colorless · transparency — visual quality of display substrates
  • Low dielectric constant · low loss — improved high-frequency signal integrity
  • Low moisture absorption · dimensional stability
  • Thermal stability · chemical resistance
Polyimide Monomer
Halocarbon 6-FXY
Colorless PI · flexible display
Role
Core monomer
Use
Colorless PI
Field
Flexible display

Core monomer for colorless polyimide film. For flexible display substrates.

Processing Aid
TFAA
Trifluoroacetic anhydride
Role
Processing aid
Use
PSPI · low-loss
Type
Anhydride

Fluorinated processing aid for photosensitive PI and low-dielectric-loss applications.

If you're evaluating flexible-display or low-dielectric applications, tell us your required specifications and scale. We'll connect you with HQ R&D for a tailored consultation.
04 · Solvents

Electronics grade solvents & processing aids

A line of high-purity solvents and processing aids required at various stages of microelectronics manufacturing. Halocarbon HFE, a low-GWP (low global warming potential) engineered fluid, is an environmentally friendly alternative to 3M Novec™ 7100, used for critical parts cleaning and as a conformal-coating carrier solvent.

Solvents
Engineered Fluid · Low GWP
Halocarbon HFE
Critical cleaning · Novec alt.
Role
Cleaning fluid
Env
Low GWP
Use
Carrier · coating

Low-GWP engineered fluid. Critical cleaning & conformal-coating carrier solvent.

Chelating Agent
HFAcAc
Semiconductor chamber cleaning
Role
Chelating
Use
Chamber clean
Field
Semi

Hexafluoroacetylacetone. Fluorinated chelating agent for semiconductor chamber cleaning.

Evaluating a Novec 7100 replacement, a low-GWP cleaning fluid, or a semiconductor chamber-cleaning solution?
WHY HALOCARBON

Fluorochemistry that scales with electronics

Commercial Scale

A system that supplies the same quality from research-scale grams to commercial-production tonnes.

75 years of expertise

Fluorochemical route-design capability accumulated since 1950. Able to handle custom structures.

Regulatory Ready

Standard document packages — COA, SDS and lot traceability — required by the highly regulated electronics industry.

CONSULTING · NDA · SAMPLES

A dedicated consultation channel for electronics-industry customers

Battery, semiconductor and display processes hinge on NDA and regulatory compliance. Wholesale Industry operates a consultation channel connected directly to HQ application engineers, providing unified support — Korean-language technical discussion + sample evaluation + localization of regulatory documents.